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Tuya T5 Connectivity MCU

Built for Agentic AI Multimodal Interfacing

Tuya T5 delivers robust wireless connectivity, low power operation, and rich peripherals for audio, vision, and sensor interfaces in advanced AIoT products.

AI workloads run in the cloud, while T5 handles real-world multisensory device interfacing

Tuya T5Wi-Fi 6 (2.4 GHz) + BLE 5.4
Module
ARMv8-M 480MHz
Camera / Audio / Graphics
Low Power
Agentic AI Ready
Tuya Cloud Integration

Tuya T5: built for Agentic AI gadgets

Tuya T5’s capability stack is the all-in-one foundation for Agentic AI — speed, connectivity, and efficiency in one place.

  • Flagship Processing: 480MHz ARMv8-M Star Core (DSP + FPU).
  • All-in-One Peripherals: 1080p camera, premium audio, smooth display — everything for immersive smart experiences.
  • Ultra-Low Power: 22nm process (16μA deep sleep) for always-on AI without battery drain.
  • Dual-Mode Connectivity: Wi-Fi 6 + Bluetooth 5.4 LE — fast, stable, long-range connectivity.
Tuya T5AI development board
TuyaOpen C SDK system architecture diagram
Trusted by 1.3M+ developers

TuyaOpen: scale Tuya T5 products globally

TuyaOpen turns Tuya T5’s raw power into market-ready innovation — cut development time, reduce costs, and scale faster.

TuyaOpen’s benefits for developers

  • Open-Source Freedom, Enterprise Reliability

    No lock-in, proven code validated by billions of devices.

  • Seamless AI Integration

    Edge-cloud intelligence and LLM integrations, optimized for Tuya T5.

  • Fast Development

    Zero-code to full-code flexibility — prototype in 8 hours, mass-produce in 15 days.

  • Global Security & Scale

    Compliant cloud, multi-layer security, and OTA updates worldwide.

Why Tuya T5 + TuyaOpen = Agentic AI success

From silicon to software to shipment — one aligned path for intelligent devices.

1

Real-Time Local AI

Powered by TFLite-ready CPU performance with AI inference support, and comes with KWS plus realtime audio 3A AI algos.

2

All-in-One Ecosystem

Cut development time by 60%+ with pre-integrated SDKs and developer support.

3

Production-Ready

Pre-certified modules, firmware services, and OEM/ODM support for fast scaling.

4

Unlimited Versatility

Build any Agentic AI gadget — no hardware or platform restrictions.

Tuya T5 dev kit board pinout diagram

Start building today: T5 dev kit + TuyaOpen

Turn your vision into a working prototype in hours with hardware fully integrated with TuyaOpen tools.

Dev kit includes

  • Pre-certified Tuya T5 module (802.11ax 2.4 GHz Wi-Fi 6 + Bluetooth 5.4 LE)
  • Full peripheral breakout (camera, LCD, audio, USB-C)
  • Pre-installed TuyaOpen SDK (AI libraries, LVGL graphics)
  • TuyaOpen setup guide + code examples
Bonus: Join TuyaOpen’s Discord and developer community for support and collaboration.
Order dev kit

Development methods that fit your workflow

Choose the stack you prefer — Tuya T5 and TuyaOpen support multiple paths from bring-up to production.

TuyaOpen C SDK icon

TuyaOpen C SDK

Enterprise-grade, full-featured SDK for deep customization and high-performance Tuya T5 projects.

Arduino IDE icon

Arduino IDE

Beginner-friendly environment with a large community and pre-built libraries for rapid prototyping.

Lua icon

Lua

Lightweight, script-based development for fast iterations from simple to complex Tuya T5 applications.

Ideal use cases

Where chip performance, TuyaOpen middleware, and cloud applications converge.

Swipe to explore →

AI Smart Glasses

Voice assistant, camera / vision pipeline, BLE audio — powered by Tuya T5, simplified by TuyaOpen.

Smart Home Agents

Voice hubs, vision sensors, HMI panels — fast to build, easy to scale.

Wearable AI Cameras

Local AI, Wi-Fi streaming, long battery life — leveraging Tuya T5’s efficiency.

Industrial AI Sensors

Machine vision, predictive maintenance — secured by Tuya’s security stack.

Smart Medical Devices

Health monitoring, local AI — aligned with global compliance expectations.

Specs

Wi-Fi

  • IEEE 802.11b/g/n/ax 1x1 compliant
  • 20/40 MHz channel bandwidth for 2.4 GHz
  • Supports downlink Multi-User Multiple-Input Multiple-Output (DL MU-MIMO)
  • Supports Orthogonal Frequency Division Multiple Access (OFDMA)
  • Supports Target Wake Time (TWT)
  • TX and RX Low-Density Parity Check (LDPC) support for extended range
  • WPA/WPA2/WPA3-Personal support for enhanced security
  • Operating modes: STA and SoftAP
  • Concurrent SoftAP + STA
  • Integrated Bluetooth/Wi-Fi coexistence (PTA)
  • TX power up to +20 dBm
  • RX sensitivity −98 dBm

Bluetooth Low Energy

  • Bluetooth 5.4 Low Energy (LE)
  • Supports Bluetooth Low Energy 1 Mbps, 2 Mbps, and long range (125 kbps and 500 kbps)
  • Supported Bluetooth Low Energy features: LE Audio, Angle of Arrival (AoA) and Angle of Departure (AoD) direction finding, 2 Mbps, advertising extensions, and long range
  • Supports an antenna array with up to 16 antennas for precise positioning

Core

  • ARMv8-M Star (M33F) MCU at up to 480 MHz
  • Double-precision floating-point unit (FPU)
  • 16 KB ITCM + 16 KB DTCM
  • Embedded TrustZone
  • Supports DSP instructions with SIMD
  • 3.84 CoreMark/MHz
  • UART flash download
  • Serial Wire Debug (SWD) interface

Memory

  • Flash up to 16 MB
  • PSRAM up to 16 MB
  • 640 KB Share SRAM
  • 64 KB ROM
  • eFuse

Clock Management

  • External oscillators: 26 MHz crystal oscillator (XTALH), 32.768 kHz crystal oscillator (XTALL)
  • Internal oscillators: 32 kHz ring oscillator (ROSC), 26–360 MHz digitally controlled oscillator (DCO)
  • 320/480 MHz PLL (DPLL)
  • Audio PLL (APLL)

Power Management

  • 2.0 to 4.35 V VBAT supply
  • On-chip Power-On Reset (POR) and Brown-Out Detector (BOD)
  • Embedded buck (DC-DC) converters and LDO regulators
  • Low power consumption:
  • Active mode RX: 17.5 mA
  • Sleep mode: 43 μA
  • Deep sleep mode: 16 μA
  • Shutdown mode: 2.5 μA

Peripherals

  • 56 GPIOs
  • 2× SPI
  • 2× QSPI
  • 3× UART: 1 with hardware flow control and flash download support
  • 1× Smart Card controller
  • 1× SDIO
  • 2× I2C
  • 1× high-speed USB2.0 (HS)
  • 1× CAN controller with CAN FD
  • 1× LIN controller
  • 2× general-purpose DMA controller (GDMA), each with 8 channels
  • 1× DMA2D controller
  • 1× rotation module
  • 2× scaling module
  • 1× display controller supporting RGB and 8080 interfaces
  • 1× segment LCD controller for up to 8 × 28 segments
  • 1× JPEG hardware encoder
  • 1× JPEG hardware decoder
  • 1× 8-bit CIS DVP interface
  • 1× 720p H.264 video encoder
  • 1× Ethernet MAC interface
  • 12× 32-bit PWM channel
  • 3× I2S
  • 1× four-band digital hardware equalizer
  • 2× audio ADC
  • 1× audio DAC
  • 1× DMIC
  • 1× SBC accelerator
  • 12-bit AUX ADC, up to 11 channels
  • 6× 32-bit general-purpose timer
  • 2× watchdog timer
  • 1× real-time counter (RTC)
  • 1× IrDA
  • 1× temperature sensor
  • 1× touch sensor, up to 16 touch sensing I/Os

Packaging

  • Two module packages:
    T5-E1 package pinout

    T5-E1

    Built-in antenna

    18.00±0.35 mm (W) × 25.50±0.35 mm (L) × 2.8±0.15 mm (H)

    Module datasheet
    T5-E1-IPEX package pinout

    T5-E1-IPEX

    IPEX connector for external antenna

    18.00±0.35 mm (W) × 19.70±0.35 mm (L) × 2.8±0.15 mm (H)

    Module datasheet
  • Packaging Hybrid LCC/LGA Module
  • Operating temperature range: −40 to +85 °C

System Diagram

T5 ChipSet Datasheet

Lead the Agentic AI revolution — start now

Lead the Agentic AI era — powered by Tuya T5, enabled by TuyaOpen.

Chip · TuyaOpen stack · Applications — ship with confidence